HumiSeal 2E42T-B
4 5 (1 evaluate)Category: Encapsulation Solutions
Manufacturer: Humiseal
Packaging: 5L, 20L
Origin: UK or USA
Product Specification
Chemistry |
Epoxy |
Viscosity Part A (CPs) |
20,000 |
Viscosity Part B (CPs) |
24,000 |
Mix Ratio |
1:1 |
Pot Life (min)* |
60 |
Handling Time (min)* |
180 |
Full Cure** |
24 hr @ RT or 2 hr @ 65 ºC |
Cure Type |
Epoxy |
Color |
Black |
Hardness |
D65 |
Operating Temp (°C) |
-50 to 155 C |
Applications |
Electronic and Industrial encapsulation |
Substrates |
Metals, Glass, Ceramics, Plastic |
HumiSeal 2E42T-B offers the following features:
-
Thermally conductive (0.83 W/mK)
-
Epoxy-based
-
2 components
-
Medium viscosity
-
Mixed at a simple 1:1 ratio
-
No VOCs or solvent
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Excellent mechanical shock and chemical resistance
-
Superior adhesion to a variety of substrates
Application of HumiSeal 2E42T-B
The cleanliness of the substrate is crucial for the proper application of HumiSeal 2E42T-B. Surfaces should be free of moisture, dirt, wax, grease, flux residues, and any other contaminants. Encapsulants can be applied successfully to substrates that have been cleaned before coating, as well as to those assembled with low-residue “no clean” materials. Users are encouraged to conduct proper testing to ensure compatibility between the encapsulant and their specific assembly materials, process conditions, and cleanliness standards.
HumiSeal® 2E42T-B is a two-part epoxy system that cures at room temperature, designed for encapsulating electronic components. This product is formulated with a simple 1:1 by volume mixing ratio, making it easy to work with. Once an electronic package is encapsulated with HumiSeal® 2E42T-B, it gains enhanced resistance to physical shocks, water exposure, and other potentially harmful chemicals.
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