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HumiSeal 2E11

4 5 (1 evaluate)

Category: Encapsulation Solutions

Manufacturer: Humiseal
Packaging: 5L, 20L
Origin: UK or USA

Product code : HumiSeal 2E11
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Highlights of HumiSeal 2E11

Product Specification

Chemistry

Epoxy

Viscosity Part A (CPs)

10,000 -15,000

Viscosity Part B (CPs)

5,000-7,000

Mix Ratio

1:2

Pot Life (min)*

60

Handling Time (min)*

180

Full Cure**

24 hr @ RT or 1 hr @ 65oC

Cure Type

2 component with heat option

Color

Amber

Hardness

D40

Operating Temp (°C)

-50 to 125 C

Applications

Electronic sealing, bonding, and encapsulation

Substrates

Metals, Glass, Ceramics, Plastics

HumiSeal 2E11 offers the following features:

  • Epoxy-based

  • 2 components

  • Medium viscosity

  • No VOCs or solvent

  • Excellent environmental resistance and moisture resistance

  • Superior adhesion to a variety of substrates

Application of HumiSeal® 2E11 

The cleanliness of the substrate is crucial for the proper application of HumiSeal 2E11. Surfaces must be free from moisture, dirt, wax, grease, flux residues, and other contaminants. Encapsulants can be effectively applied to substrates that are cleaned before coating, as well as to those assembled with low-residue "no clean" materials. It is recommended that users conduct thorough testing to ensure compatibility between the encapsulants and their specific assembly materials, process conditions, and cleanliness standards.

HumiSeal® 2E11 is a two-part epoxy system that cures at room temperature, specifically designed for electronic sealing, encapsulating, and potting applications. This product features a straightforward 1:2 volume mixing ratio. HumiSeal 2E11 offers excellent adhesion to a wide range of substrates, including most metals and plastics.

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