HumiSeal 2E11
4 5 (1 evaluate)Category: Encapsulation Solutions
Manufacturer: Humiseal
Packaging: 5L, 20L
Origin: UK or USA
Product Specification
|
Chemistry |
Epoxy |
|
Viscosity Part A (CPs) |
10,000 -15,000 |
|
Viscosity Part B (CPs) |
5,000-7,000 |
|
Mix Ratio |
1:2 |
|
Pot Life (min)* |
60 |
|
Handling Time (min)* |
180 |
|
Full Cure** |
24 hr @ RT or 1 hr @ 65oC |
|
Cure Type |
2 component with heat option |
|
Color |
Amber |
|
Hardness |
D40 |
|
Operating Temp (°C) |
-50 to 125 C |
|
Applications |
Electronic sealing, bonding, and encapsulation |
|
Substrates |
Metals, Glass, Ceramics, Plastics |
HumiSeal 2E11 offers the following features:
-
Epoxy-based
-
2 components
-
Medium viscosity
-
No VOCs or solvent
-
Excellent environmental resistance and moisture resistance
-
Superior adhesion to a variety of substrates
Application of HumiSeal® 2E11
The cleanliness of the substrate is crucial for the proper application of HumiSeal 2E11. Surfaces must be free from moisture, dirt, wax, grease, flux residues, and other contaminants. Encapsulants can be effectively applied to substrates that are cleaned before coating, as well as to those assembled with low-residue "no clean" materials. It is recommended that users conduct thorough testing to ensure compatibility between the encapsulants and their specific assembly materials, process conditions, and cleanliness standards.
HumiSeal® 2E11 is a two-part epoxy system that cures at room temperature, specifically designed for electronic sealing, encapsulating, and potting applications. This product features a straightforward 1:2 volume mixing ratio. HumiSeal 2E11 offers excellent adhesion to a wide range of substrates, including most metals and plastics.
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