HumiSeal 2E10-B

Product Specification

HumiSeal 2E10-B offers the following features:

• Epoxy-based

• 2 components

• Medium viscosity

• Self-leveling

• High dielectric strength

• No VOCs or solvent

• Excellent environmental resistance and moisture resistance

• Superior adhesion to a variety of substrates

Application of HumiSeal® 2E10-B

Proper cleanliness of the substrate is crucial for the effective application of HumiSeal 2E10-B. The surfaces must be free from moisture, dirt, wax, grease, flux residues, and other contaminants. Encapsulants can be applied successfully to substrates that have been thoroughly cleaned before coating and those assembled with low-residue “no clean” materials. Users should conduct appropriate tests to ensure compatibility between the encapsulants and their specific materials, process conditions, and cleanliness levels.

HumiSeal® 2E10-B is a two-part epoxy potting compound with an extended working time, ideal for electronic applications. This system mixes easily in a 1:1 ratio and cures to form a rigid, black encapsulant. HumiSeal 2E10-B offers excellent protection against environmental and chemical factors, with a high dielectric strength of 550 V/mil.