HumiSeal 2E41T-B

Product Specification

HumiSeal 2E41T-B offers the following features:

• Thermally conductive (1.29 W/mK)

• Epoxy-based

• 2 components

• Medium viscosity

• Mixed at a simple 1:1 ratio

• No VOCs or solvent

• Excellent mechanical shock and chemical resistance

• Superior adhesion to a variety of substrates

Application of HumiSeal 2E41T-B

The cleanliness of the substrate is essential for the effective application of HumiSeal 2E41T-B. Surfaces must be free from moisture, dirt, wax, grease, flux residues, and any other contaminants. Encapsulants can be applied successfully to substrates that have been cleaned before coating, as well as to those assembled with low-residue “no clean” materials. It is important for users to carry out appropriate testing to ensure compatibility between the encapsulant and their specific assembly materials, process conditions, and cleanliness standards.

HumiSeal® 2E41T-B is a two-part epoxy system that cures at room temperature, specifically designed for encapsulating electronic components. This product is formulated with a convenient 1:1 by volume mixing ratio, making it easy to use. Once an electronic package is encapsulated with HumiSeal® 2E41T-B, it will show improved resistance to physical impacts, water, and other potentially harmful chemicals.