- Client Duong Do dinh - (0986490xxx) bought 8 month ago (25/11/2025)
Galden® LS 200 - Vapor Phase Soldering Fluid
4 5 (1 evaluate)Category: Galden® LS/HS
Maker: Syensqo
Made in: Italy
Packaging: 1kg, 5kg
What Is Galden® LS 200?
Galden® LS 200 is a high-purity perfluoropolyether (PFPE) fluid specifically designed for vapor-phase soldering at a controlled temperature of approximately 200°C. It is primarily used for tin-lead and compatible low-melting-point solder alloys.
Its narrow molecular-weight distribution creates a stable vapor temperature, enabling uniform condensation heating across complex PCB assemblies while limiting the risk of overheating. Galden® LS 200 is also chemically inert, electrically insulating, non-flammable and resistant to residue formation under recommended operating conditions.
Key Features and Process Benefits
| Feature | Process and Customer Benefit |
|---|---|
| Controlled 200°C vapor temperature | Provides a defined thermal ceiling, reducing the risk of overheating temperature-sensitive components and PCB materials. |
| Narrow molecular-weight distribution | Minimizes boiling-point drift and supports stable, repeatable soldering profiles over successive production cycles. |
| Uniform condensation heating | Transfers heat across the complete assembly, including areas shadowed by large components or complex board geometries. |
| Low heat of vaporization | Supports efficient heat transfer, rapid process response and residue-free drying after the assembly leaves the vapor zone. |
| Vapor density greater than air | Helps create an inert vapor blanket around the assembly during preheating and reflow, limiting exposure to oxygen. |
| Excellent thermal and chemical stability | Reduces fluid degradation and helps maintain consistent performance during repeated heating cycles. |
| Good construction-material compatibility | Helps prevent corrosion or undesirable reactions with compatible VPS equipment materials. |
| No decomposition residue under recommended conditions | Supports clean processing and reduces deposit-related maintenance inside the soldering chamber. |
| Non-flammable PFPE fluid | Has no flash point, fire point or auto-ignition point under standard test conditions, improving high-temperature process safety. |
| Good dielectric properties | Reduces electrical-conductivity concerns when processing sensitive electronic assemblies. |
| Clear and high-purity liquid | Supports clean electronics-manufacturing processes without introducing conventional hydrocarbon contamination. |
| Long storage stability | Galden® PFPE fluids are chemically stable for more than 20 years when stored in their original sealed containers. |
These characteristics are documented by Syensqo and specialist Galden® distributors for the LS/HS Vapor Phase Soldering range.
Technical Properties
The following values are typical properties at 25°C unless otherwise specified. They are intended for product comparison and preliminary process evaluation rather than as guaranteed acceptance specifications.
| Property | Typical Value | Unit |
|---|---|---|
| Chemical family | PFPE | — |
| Physical appearance | Clear, colorless liquid | — |
| Boiling point / nominal vapor temperature | 200 | °C |
| Density at 25°C | 1.79 | g/cm³ |
| Kinematic viscosity at 25°C | 2.50 | cSt |
| Vapor pressure at 25°C | 21 | Pa |
| Specific heat at 25°C | 973 | J/kg·°C |
| Heat of vaporization at boiling point | 63 | J/g |
| Thermal conductivity at 25°C | 0.07 | W/m·°C |
| Coefficient of thermal expansion | 0.0011 | cm³/cm³·°C |
| Surface tension | 19 | dyne/cm |
| Dielectric strength | 40 at 2.54 mm gap | kV |
| Dielectric constant | 2.1 | — |
| Volume resistivity | 1 × 10¹⁵ | Ω·cm |
| Average molecular weight | 870 | amu |
| Flash, fire and auto-ignition points | None under standard tests | — |
Important unit note: The manufacturer’s LS/HS comparison table reports the vapor pressure of LS 200 as 21 Pa at 25°C, not 21 torr.
For production qualification, users should review the latest product specification, including Temperature Reflux Vapor, or TRV, and distillation range. Syensqo explains that TRV applies specifically to LS/HS vapor-phase fluids, whereas Temperature Reflux Liquid applies to Galden® HT heat-transfer grades.
Galden® LS/HS Series Comparison
The main difference among Galden® LS/HS grades is their controlled boiling or vapor temperature. Higher-temperature grades also have progressively higher viscosity, molecular weight and lower room-temperature vapor pressure.
| Grade | Boiling Point | Density at 25°C | Viscosity at 25°C | Vapor Pressure at 25°C | Typical Selection Profile |
|---|---|---|---|---|---|
| Galden® LS 200 | 200°C | 1.79 g/cm³ | 2.50 cSt | 21 Pa | Tin-lead and compatible low-melting solder profiles |
| Galden® LS 215 | 215°C | 1.80 g/cm³ | 3.80 cSt | 12 Pa | Higher-temperature conventional or specially qualified reflow profiles |
| Galden® LS 230 | 230°C | 1.82 g/cm³ | 4.40 cSt | 3.4 Pa | Lead-free soldering, including compatible Sn-Cu-Ag processes |
| Galden® HS 240 | 240°C | 1.82 g/cm³ | 5.30 cSt | 1 Pa | Higher-temperature lead-free soldering, including compatible Sn-Cu alloys |
| Galden® HS 260 | 260°C | 1.83 g/cm³ | 7.00 cSt | 1 Pa | Special high-temperature solder alloys and demanding reflow profiles |
How LS 200 Differs from Other Grades
Compared with LS 215: LS 200 provides a 15°C lower vapor temperature and slightly lower viscosity. It is preferable when the validated solder paste and assembly must remain near or below 200°C.
Compared with LS 230: LS 200 is not intended for standard SAC lead-free profiles requiring peak temperatures above 200°C. LS 230 provides the higher temperature required for many Sn-Ag-Cu alloys.
Compared with HS 240 and HS 260: LS 200 reduces thermal exposure but cannot provide the energy or peak temperature required by high-temperature lead-free and specialized solder alloys.
All five grades share similar specific heat, heat of vaporization, thermal conductivity, dielectric strength and general PFPE chemical stability. Grade selection should therefore begin with the solder alloy’s qualified reflow window rather than fluid viscosity alone.
Common Applications
1. Tin-Lead PCB Vapor Phase Reflow
The principal application of Galden® LS 200 is Vapor Phase Soldering of printed circuit board assemblies using conventional tin-lead solder. Traditional Sn/Pb solder melts at approximately 180°C, and the 200°C vapor layer provides the thermal margin required for reflow while limiting excessive component temperatures.
2. Low-Melting-Point Solder Alloys
LS 200 may also be considered for low-melting solder alloys whose validated peak-temperature requirement remains below its 200°C vapor temperature. Compatibility must be confirmed against the solder-paste supplier’s recommended thermal profile because not every lead-free alloy can be processed at this temperature.
3. Temperature-Sensitive Electronic Assemblies
The defined 200°C vapor temperature can help protect assemblies containing components, connectors, substrates or polymers that may be damaged by the higher peak temperatures used in mainstream lead-free soldering. The process temperature remains limited by the fluid’s saturation temperature under properly controlled machine conditions.
4. High-Mix and Prototype PCB Production
Galden® LS 200 is suitable for R&D, prototyping and high-mix production where boards using compatible solder alloys require repeatable heating without developing a separate convection profile for every component layout. A specialist Galden® distributor positions LS 200 for prototyping and high-mix Vapor Phase Soldering lines operating around 200°C.
5. Complex and Mixed-Thermal-Mass Assemblies
Condensation heating reaches exposed surfaces across the complete assembly, making VPS useful for boards containing a mixture of small components, large connectors, shielding structures and other parts with different thermal masses. LS 200 is appropriate when the required alloy and assembly peak temperature remain compatible with 200°C.
6. Controlled Reflow of Legacy and Replacement Electronics
LS 200 can support the manufacture, refurbishment or replacement of legacy electronic assemblies originally qualified with Sn/Pb solder and lower-temperature reflow conditions. It allows the original thermal window to be maintained without exposing the assembly to the 230–260°C vapor temperatures of higher LS/HS grades.
Frequently Asked Questions
1. What is Galden® LS 200 used for?
Galden® LS 200 is primarily used as the working fluid in Vapor Phase Soldering systems operating at a nominal vapor temperature of 200°C. Its main use is reflow soldering of tin-lead and other compatible low-melting solder alloys.
2. Is Galden® LS 200 suitable for lead-free soldering?
LS 200 is not the standard choice for mainstream SAC lead-free solder pastes, which commonly require peak temperatures above 200°C. The manufacturer’s brochure positions LS 200 for leaded solder, while LS 230, HS 240 and HS 260 are intended for progressively higher-temperature lead-free processes. A low-melting lead-free alloy may be compatible only when its supplier-approved profile can be completed within the LS 200 process window.
3. What is the difference between Galden® LS 200 and Galden® HT 200?
Although both have a nominal 200°C boiling point, they are not automatically interchangeable. LS 200 is specifically manufactured for Vapor Phase Soldering with a controlled narrow molecular-weight distribution, distillation range and vapor temperature. HT 200 is formulated as a general heat-transfer fluid. Syensqo states that TRV and distillation range are critical specification parameters for LS/HS grades.
4. Why does Galden® LS 200 help prevent PCB overheating?
In a properly controlled VPS system, the board cannot normally become hotter than the saturated vapor surrounding it. Because LS 200 produces a defined vapor temperature near 200°C at atmospheric pressure, it establishes a self-limiting thermal environment and reduces the risk of uncontrolled peak-temperature overshoot.
5. Does Galden® LS 200 leave residue or cause corrosion?
Under recommended operating conditions, Galden® LS/HS fluids are chemically stable, compatible with many construction materials and do not normally form decomposition residues. This supports clean drying and helps reduce corrosion, chamber deposits and fluid-degradation-related maintenance. Compatibility should still be verified with the actual seals, plastics, metals and process contaminants used in the equipment.
6. How should Galden® LS 200 be selected, stored and maintained?
The fluid should be selected according to the solder alloy, target liquidus temperature, allowable component peak temperature and VPS machine design. Users should monitor fluid level and contamination and avoid mixing LS 200 with other grades unless the resulting vapor-temperature characteristics have been technically evaluated. When stored in its original sealed container, Galden® PFPE is chemically stable for more than 20 years.
AAdministratorsQTV
Welcome. Feel free to leave a comment, we will respond soon