HumiSeal Epoxy Adhesive 2E33-G
4 5 (1 evaluate)Category: Adhesive Solutions
Manufacturer: Humiseal
Packaging: 5L, 20L
Origin: UK or USA
Product Specification
Chemistry |
Epoxy |
Viscosity Part A (CPs) |
Thixotropic |
Viscosity Part B (CPs) |
Thixotropic |
Mix Ratio |
1:1 |
Pot Life (min)* |
100 |
Handling Time (min)* |
180 |
Full Cure** |
24 hr @ RT or 1 hr @ 110º C |
Cure Type |
2 component with heat option |
Color |
Silver |
Hardness |
D40 |
Operating Temp (°C) |
-50 to 155 C |
Applications |
Solder Replacement |
Substrates |
Metals, plastics |
HumiSeal Epoxy Adhesive 2E33-G offers the following features:
-
2 component epoxy-based
-
Electrically conductive
-
Used as a solder replacement
-
Superior chemical and temperature resistance
-
No VOCs or solvent
-
Excellent adhesion to a variety of substrates
Application of HumiSeal® 2E33-G
For optimal performance, it is essential that substrates are thoroughly cleaned before applying HumiSeal 2E33-G. Surfaces must be free of contaminants such as moisture, dirt, wax, grease, and flux residues. Adhesives can be effectively applied to substrates that have been cleaned beforehand or to those assembled with low-residue, “no clean” materials. It is recommended that users conduct proper testing to ensure compatibility between the adhesives and their specific assembly materials, process conditions, and cleanliness levels.
HumiSeal® 2E33-G is a two-part, silver-filled epoxy system with a long work life, designed as a solder replacement. This free-flowing liquid can cure at room temperature within 24 to 48 hours. Once cured, it provides excellent electrical conductivity, high flexibility, and outstanding chemical resistance.
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