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Galden HS 260

4 5 (1 evaluate)

Category: Galden® LS/HS

Maker: Syensqo

Made in: Italy

Packaging: 1kg, 5kg

Product code : Galden HS 260
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Highlights of Galden HS 260

What is Galden HS 260?

Galden HS 260 is a collection of fully fluorinated liquids tailored for the Vapor Phase Soldering process. Its precise molecular weight range, along with the strong carbon-fluorine bond and adaptable ether linkage, delivers the characteristics that make Galden HS 260 ideal for Vapor Phase Soldering applications.

Key features of Galden HS 260

Feature Customer Benefit
260°C boiling point Accurate temperature control for high-temperature vapor phase soldering
Narrow molecular weight distribution Stable boiling temperature with minimal process drift
High thermal stability Longer fluid service life and more consistent performance
Chemical inertness Excellent compatibility with PCB materials and electronic components
Non-flammable Improved operational safety in high-temperature soldering processes
High purity Cleaner soldering environment with reduced contamination risk
Dielectric fluid Safe for processing electronic assemblies and sensitive components
Uniform vapor heating More consistent reflow and improved solder-joint quality
Controlled maximum temperature Helps reduce the risk of component and PCB overheating
Low moisture absorption Supports stable processing conditions and reliable soldering quality
Residue-free evaporation Less cleaning, equipment contamination and maintenance
Suitable for lead-free VPS Supports demanding lead-free soldering profiles requiring temperatures up to 260°C

Technical data sheet of Galden HS 260

Physical

Property

Typical Value

Unit

Average Molecular Weight

1210

amu

Density (25°C)

1.83

g/cm³

Kinematic Viscosity (25°C)

7.00

cSt

Surface Tension

20

dyne/cm

Vapor Pressure (25°C)

1

Pa

Thermal

Property

Typical Value

Unit

Boiling Point

260

°C

Heat of Vaporization - at Boiling Point

63.0

J/g

Specific Heat Capacity (25°C)

0.23

cal/g/°C

Electrical

Property

Typical Value

Unit

Dielectric Constant

2.10

 

Dielectric Strength - 2.54mm gap

40

kV

Volume Resistance

1E15

ohms·cm

Galden® LS/HS Series Comparison

Property LS200 LS215 LS230 HS240 HS260
Boiling Point 200°C 215°C 230°C 240°C 260°C
Density @ 25°C 1.79 g/cm³ 1.80 g/cm³ 1.82 g/cm³ 1.82 g/cm³ 1.83 g/cm³
Kinematic Viscosity @ 25°C 2.5 cSt 3.8 cSt 4.4 cSt 5.3 cSt 7.0 cSt
Vapor Pressure @ 25°C 21 Pa 12 Pa 3.4 Pa 1 Pa 1 Pa
Dielectric Strength 40 kV 40 kV 40 kV 40 kV 40 kV
Chemical Stability Excellent Excellent Excellent Excellent Excellent
Flammability Non-flammable Non-flammable Non-flammable Non-flammable Non-flammable
Residue Virtually none Virtually none Virtually none Virtually none Virtually none

Additional Information

Property

Typical Value

Unit

Thermal Conductivity (25°C)

0.07

W/m°C

Coefficient of Expansion

0.0011

cm³/cm³°C

Applications

1. High-temperature lead-free vapor phase soldering

Galden HS 260 is used as the process fluid in VPS equipment for soldering electronic components and semiconductor packages onto printed circuit boards. It represents the highest-temperature grade in the Galden LS/HS range and is intended for processes requiring temperatures approaching 260°C.

2. Reflow of complex or high-thermal-mass PCB assemblies

The condensation-based heating mechanism can provide uniform heat transfer around components with different sizes, geometries and thermal masses. HS 260 may therefore be suitable for:

  • Thick or multilayer printed circuit boards
  • Power electronics assemblies
  • Large connectors, transformers and inductors
  • Assemblies containing substantial copper areas
  • High-density electronic modules

This application suitability is an engineering inference from the uniform condensation-heating principle used in VPS.

3. Specialized solder alloys and high-temperature reflow profiles

HS 260 can support lead-free or specialized soldering processes whose validated profile requires a higher vapor temperature than Galden LS 230 or HS 240 can provide. The grade must still be selected according to the solder-paste specification and the maximum temperature ratings of the PCB, components, connectors and polymeric materials.

FAQ

1. What is Galden® HS 260 primarily used for?

It is primarily used as the working fluid in vapor phase soldering equipment for mounting electronic components and semiconductor devices onto printed circuit boards. The process uses the latent heat released when Galden vapor condenses on the cooler assembly.

2. How does Galden® HS 260 help prevent overheating?

The maximum heating temperature is controlled by the fluid’s vapor temperature. Once the assembly reaches the vapor temperature, condensation decreases significantly, providing a natural thermal limit and helping protect PCBs and components from uncontrolled overheating.

3. Is Galden® HS 260 suitable for lead-free soldering?

Yes. Syensqo positions Galden® LS/HS fluids as lead-free VPS solutions capable of supporting processing temperatures up to 260°C. The LS/HS product family is also described as RoHS compliant.

4. What types of assemblies may benefit from Galden® HS 260?

It may be appropriate for validated VPS profiles involving high-thermal-mass or complex assemblies, such as multilayer PCBs, power-electronics modules, large connectors, transformers and boards with substantial copper content. Suitability must be confirmed against the solder-paste specification and the temperature ratings of every component and substrate.

5. What is the shelf life of Galden® HS 260?

Syensqo states that Galden PFPE fluids remain chemically stable for more than 20 years when stored in their original sealed containers. Actual storage requirements should follow the current product safety data sheet and local handling regulations.

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