Galden® LS/HS Vapor Phase Soldering Fluids: High-Performance Solutions for Precise PCB Assembly

Galden® LS/HS Vapor Phase Soldering Fluids: High-Performance Solutions for Precise PCB Assembly

Galden® LS/HS is a line of fully fluorinated fluids specifically designed for the Vapor Phase Soldering process

Galden® LS/HS is a line of fully fluorinated fluids specifically designed for the Vapor Phase Soldering process. The narrow molecular weight distribution as well as the very strong carbon-fluorine bond and the flexible ether link provide the properties which make Galden® LS/HS ideal for use in VPS.

Features and Benefits of Galden® LS/HS

Features

Benefits

Wide choice of grades with different boiling point

Widest operating temperature range to optimize VPS process

Narrow molecular weight distribution

Maximum process stability and repeatability 

No boiling point drift

Low heat of vaporization 

Vapor density greater than air

Rapid and residue free drying 

Pre-heating and heating processes take place in an inert atmosphere

Excellent thermal and chemical stability 

Good compatibility with materials

No corrosion or reaction with materials of construction 

No formation of decomposition residues

No flash or fire points 

No auto ignition point 

No explosion hazards

Enhanced safety 

Safe to use at high temperature

Vapor Phase Soldering and Lead-Free Solder 

RoHS (Restriction of Hazardous Substances) emphasizes lead reduction importance and compels manufacturers to produce and deliver lead-free equipment. 

Lead-free printed circuit boards (PCBs) have been a crucial protagonist of this innovation; solder was traditionally composed of ~60% tin (Sn) and ~40% lead (Pb), whereas modern lead-free solders include silver (Ag), Copper (Cu) and Bismuth (Bi) as tin-alloying elements. While traditional tin/lead solder melts at ~180°C, lead-free solder melts at ~227°C, creating challenges for PCB manufacturers. 

Aside the high soldering temperatures, several heating criticalities come with the more complex and crowded PCBs, the integrated circuit (IC) substrate designs due to the miniaturization of electronic devices like smartphones and wearables, and the heterogeneous packaging of the electronic components like chiplets and system in package designs. All these challenges can be readily addressed through vapor phase soldering thanks to Galden® LS and HS grades. 

Enabling vapor phase soldering technology, thanks to their narrow molecular weight distribution, Galden® LS and HS bring the following benefits compared to alternative technologies: 

• Precise temperature control based on the fluid’s boiling point 

• Absence of shadow effects typical of convective and radiative heating 

• Accurate and uniform heat delivery, avoiding overheating and reducing the risk of the tombstoning effect 

• Short soldering time, leading to lower the induced mechanical and thermal stress for the components 

Galden® LS and HS grades for vapor phase soldering offer the best lead-free process solution since: 

• Galden® LS and HS fluids are RoHS compliant 

• Galden® LS and HS fluids have zero Ozone Depletion Potential (ODP) 

• Galden® LS and HS fluids offer the broadest temperature range for lead-free solder up to 260°C

Safety 

Galden® LS and HS grades for vapor phase soldering offer favorable environmental and worker safety properties: non-toxicity, non-flammability, and Zero Ozone Depletion Potential (ODP). Furthermore, Galden® LS and HS fluids exhibit high chemical and thermal stability and are safe to use up to 290°C. 

The chemical inertness and non-corrosive nature of Galden® LS and HS fluids make them outstandingly safe for workers to handle and improve overall workplace safety.

Vapor Phase Soldering (Typical Properties at 25°C)

Properties     

Units

LS200 

LS215

LS230

HS240

HS260

Boiling point           

°C

200

215 

230

240

260

Density 

g/cm3

1.79

1.80

1.82

1.82

1.83

Kinematic viscosity             

cSt

2.50

3.80

4.40

5.30

7.00

Vapor pressure

Pa

21

12

3.4

1

Specific heat   

J/Kg·°C

973

Heat of vap. at boiling point   

J/g

63

Thermal conductivity

W/m·°C

0.07

Coefficient of expansion

cm3/cm3 ·°C

0.0011

Surface tension        

dyne/cm

19

20 

20

20

20

Dielectric strength 

kV (2.54 mm gap)

40

Dielectric constant 

 

2.1

Volume resistivity 

Ohm·cm

1015

Average molecular weight

amu

870

950

1,020

1,085

1,210

- Syensqo

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